MultiLane participated at the TestConX China 2020 virtual event that was held from October 27 -29. TestConX has, over the course of its twenty-year history, established itself as the preeminent event for test consumables, test cell integration, and test operations.
The program scope has expanded over these years from packaged semiconductor “final” test and burn-in to encompass all practical aspects of electronics testing including validation, advanced packaging testing, system level test, module test, and beyond to finished product test.

This year, Doug Malech and Chuong Huynh represented MultiLane to talk about high-speed serial testing.

Click here to watch the presentation.